NOBLE METAL-COATED COPPER WIRE FOR BALL BONDING
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United States of America Patent
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May 4, 2017
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Oct 28, 2016
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Nov 2, 2015
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Abstract
A noble metal-coated copper wire for ball bonding, with a wire diameter between 10 μm or more, and 25 μm or less, includes a core material having a copper alloy having a copper purity of 98 mass % or higher, and a noble metal-coating layer formed on the core material. The noble metal-coating layer includes a palladium cavitating layer containing palladium; at least one element selected from the group consisting of Group 13 to 16 elements or an oxygen element, finely dispersed in the palladium; and a diffusion layer formed of copper diffused into the palladium. The noble metal-coating layer may include a palladium cavitating layer containing palladium, at least one element selected from the group consisting of Group 13 to 16 elements or an oxygen element, finely dispersed therein, and a nickel intermediate layer disposed between the core material and the noble metal-coating layer.
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