ALUMINUM PLATING SOLUTION, METHOD FOR MANUFACTURING ALUMINUM FILM, AND POROUS ALUMINUM OBJECT
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United States of America Patent
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Jun 4, 2015
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Jun 24, 2014
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Provided is an aluminum plating solution capable of continuously manufacturing an aluminum film, the surface of which is smooth and which has good elongation. The aluminum plating solution capable of electrodepositing aluminum on a surface of a base contains, as components, (A) an aluminum halide, (B) at least one compound selected from the group consisting of alkylimidazolium halides, alkylpyridinium halides, and urea compounds, and (C1) at least one selected from the group consisting of ammonium salts, phosphonium salts, sulfonium salts, amine compounds, phosphine compounds, and sulfide compounds. The component (C1) has, as at least one side chain, a straight-chain or branched alkyl group having 8 or more and 36 or less carbon atoms. A mixing ratio of the component (A) and the component (B) is in a range of 1:1 to 3:1 in terms of molar ratio. A concentration of the component (C1) is 1.0 g/L or more and 45 g/L or less.
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