CYLINDER ETCHING APPARATUS

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United States of America Patent

APP PUB NO 20170120573A1
SERIAL NO

15301756

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a cylinder etching apparatus, which is capable of performing etching more uniformly than in the prior art and is also capable of solving a problem in that a remaining etching solution in an etching solution supply tube flows down therefrom. The cylinder etching apparatus includes: a processing bath; chuck means; at least one etching solution supply tube; and a plurality of ejection nozzles juxtaposed in the etching solution supply tube and configured to eject an etching solution from the etching solution supply tube. The etching solution ejected from the ejection nozzles through the etching solution supply tube is caused to impinge against a surface of the cylinder to be processed, to thereby etch the surface of the cylinder to be processed. The ejection nozzles are oriented obliquely upward with respect to a horizontal direction. An ejection direction of the ejection nozzle is oriented toward a rotation center of the cylinder to be processed from a position that is obliquely downward of the cylinder to be processed. The ejection nozzles are arranged so as to be brought closer to and away from the surface of the cylinder to be processed.

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Patent Owner(s)

Patent OwnerAddress
THINK LABORATORY CO LTDKASHIWA-SHI CHIBA 277-8525

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SHIGETA, Tatsuo Chiba, JP 54 317

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