Manufacturing method of test socket and test method for semiconductor package
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United States of America Patent
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Nov 5, 2019
Grant Date -
Apr 27, 2017
app pub date -
Sep 8, 2016
filing date -
Oct 21, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
Configuring a test socket to electrically couple a semiconductor package to a test device includes preparing a test socket including a base material and a first conductive portion included in the base material. The first conductive portion may extend in a thickness direction of the base material. Configuring the test socket may include forming a second conductive portion including conductive ink on the first conductive pattern. The second conductive portion may be formed based on printing conductive ink on the first conductive portion. The configuring may include forming the second conductive portion to repair the test socket. The first conductive portion may be degraded such that a top surface of the first conductive portion includes a surface depression. The second conductive portion may fill the surface depression. The first and second conductive portions may be integral with each other.
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