ELECTRONIC DEVICE
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United States of America Patent
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Issued Date -
Apr 27, 2017
app pub date -
Oct 27, 2016
filing date -
Oct 27, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed are embodiments related to a device connected to a socket provided in an external device. The device includes: a first connector configured to couple to a receptacle of a first external device; a second connector; a plurality of wires each including a first end connected to the first connector and a second end connected to the second connector; and a material that insulates the wires. The first connector includes: a first structure capable of coupling to the receptacle; a non-conductive second structure connected to the first structure; a plurality of contacts, each of which includes a first portion included inside the first structure, and a second portion included inside the second structure; and a circuit structure that connects two of the second portions of the contacts. At least some of wires are disposed to contact with a corresponding one of the contacts without using a solder.
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