Importance

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Abstract

A molded interconnecting substrate has an embedded redistribution layer (RDL), an embossed RDL, a plurality of conductive pillars encapsulated in a molding core, and a chip also encapsulated in the molded core. The conductive pillars are disposed on the external pads of the embedded RDL. The chip is die-bonded onto the embedded RDL. The molding core has an external surface and an opposing component-installing surface. The embedded RDL is embedded in the molding core from the external surface. The bottom surface of the embedded RDL is coplanar to the external surface and the pillar-top surfaces of the conductive pillars are coplanar to the component-installing surface. The embossed RDL is disposed on and extruded from the component-installing surface including a plurality of pillar-top pads aligned and bonded to the pillar-top surfaces. Accordingly, it is possible to eliminate a flip-chip molding thickness without manufacture of substrate plating lines where fine-pitch substrate circuitry can be achieved without substrate drilling process.

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First Claim