Method and system for a chip-on-wafer-on-substrate assembly
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United States of America Patent
Stats
-
Mar 6, 2018
Issued Date -
N/A
app pub date -
Oct 20, 2016
filing date -
Oct 21, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Methods and systems for a chip-on-wafer-on-substrate assembly are disclosed and may include in an integrated optical communication system comprising an electronics die and a substrate. The electronics die is bonded to a first surface of a photonic interposer and the substrate is coupled to a second surface of the photonic interposer opposite to the first surface. An optical fiber and a light source assembly are coupled to the second surface of the interposer in one or more cavities formed in the substrate. The integrated optical communication system is operable to receive a continuous wave (CW) optical signal in the photonic interposer from the light source assembly; and communicate a modulated optical signal to the optical fiber from said photonic interposer. A mold compound may be on the first surface of the interposer and in contact with the electronics die. The received CW optical signal may be coupled to an optical waveguide in the photonic interposer using a grating coupler.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2016 Application Filing Year
- H04B Class
- 10354 Applications Filed
- 8441 Patents Issued To-Date
- 81.53 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 2 Citation Count
- H04B Class
- 20.43 % this patent is cited more than
- 7 Age
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