RESIN COMPOSITION AND FORMED ARTICLE THEREOF

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United States of America Patent

SERIAL NO

15316849

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Abstract

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Disclosed is a resin composition including a polyamide (A), a polyester (B) and a white pigment (C), wherein (A) has a melting point of 280° C. or higher, (B) is polycyclohexylenedimethylene terephthalate, a mass ratio (A/B) is 5/95 to 95/5, and a content of (C) is 10 to 150 parts by mass in relation to 100 parts by mass of a total amount of (A) and (B).

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Patent Owner(s)

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UNITIKA LTDAMAGASAKI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Amari, Taiyo Kyoto, JP 4 15
Kabashima, Yohei Kyoto, JP 11 86
Kamikawa, Hiroo Kyoto, JP 18 79
Mii, Junichi Kyoto, JP 4 15

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  • H01L Class
  • 18.50 % this patent is cited more than
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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges26979357140748325312788503629173801 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050010001500200025003000350040004500500055006000650070007500800085009000950010000

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