Method for dividing brittle-material substrate
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United States of America Patent
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Feb 23, 2021
Grant Date -
Apr 27, 2017
app pub date -
Mar 12, 2015
filing date -
Mar 31, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A cutter edge is pressed against a brittle-material substrate so that a protruding portion of the cutter edge is positioned between a first edge of the brittle-material substrate and a side portion of the cutter edge and that a side portion of the cutter edge is positioned between the protruding portion of the cutter edge and a second edge of the brittle-material substrate. A scribe line is formed by a scratch between a first position closer to the first edge of the first and second edges and a second position closer to the second edge of the first and second edges. After the formation of the scribe line, a crack is extended in a thickness direction from the second position toward the first position along the scribe line, thus forming a crack line.
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