CHIP PACKAGE AND METHOD FOR MANUFACTURING SAME
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United States of America Patent
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app pub date -
Dec 11, 2015
filing date -
Oct 19, 2015
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Abandoned
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Abstract
A chip package can include a chip, a plurality of metal posts, an encapsulating body and a redistribution layer. The plurality of metal posts surrounds the chip. The encapsulating body surrounds the chip and the plurality of metal posts. The redistribution layer is coupled to the encapsulating body and electrically coupled to the chip and the plurality of metal posts. A method for manufacturing the chip package is also provided.
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