MOLD AND MANUFACTURING METHOD THEREOF

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United States of America Patent

SERIAL NO

15265727

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Abstract

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A mold includes a mold body, a porous conductive sheet and an electroformed metal. The porous conductive sheet is placed on a back surface of the mold body, has a plurality of through holes, and is conductive at least at its surface. The electroformed metal is electrodeposited on the back surface of the mold body and on the porous conductive sheet so as to fill and close the through holes of the porous conductive sheet. In the mold, an inner surface of the electroformed metal forms at least a part of an inner surface of a fluid passage through which fluid for temperature control flows.

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Patent Owner(s)

Patent OwnerAddress
KTX CORPORATIONKONAN-SHI AICHI 483-8111

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
SATO, Katsuya Konan-shi, JP 20 284

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