PZT THIN FILM LAMINATE AND MANUFACTURING METHOD THEREOF

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United States of America Patent

SERIAL NO

15388000

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Abstract

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The present invention provides a technology for preventing the generation of a pyrochlore phase, which is an impurity phase, in forming a PZT thin film by sputtering, without using a conventional seed layer. The present invention provides a PZT thin film laminate including: a Si substrate 10; a TiOx layer 4 serving as a platinum-adhesion layer on the Si substrate 10; a Pt electrode layer 5 on the TiOx layer 4; a Ti thin film layer 6 on the Pt electrode layer 5; and a PZT thin film layer 7 on the Ti thin film layer 6. The Ti thin film layer 6 can have a thickness of 1 nm or more and 10 nm or less.

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Patent Owner(s)

Patent OwnerAddress
ULVAC INCKANAGAWA JAPAN KANAGAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HENMI, Mitsunori Chigasaki-shi, JP 7 2
HIROSE, Mitsutaka Chigasaki-shi, JP 5 2
KIMURA, Isamu Chigasaki-shi, JP 4 63
KOBAYASHI, Hiroki Chigasaki-shi, JP 248 1354
SUU, Koukou Chigasaki-shi, JP 55 882
TSUKAGOSHI, Kazuya Chigasaki-shi, JP 5 34
TSUYUKI, Tatsuro Chigasaki-shi, JP 1 0

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