Method for designing vehicle controller-only semiconductor based on die and vehicle controller-only semiconductor by the same
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United States of America Patent
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Jan 26, 2021
Grant Date -
Apr 13, 2017
app pub date -
Dec 22, 2016
filing date -
Dec 22, 2014
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Abstract
The present invention relates to a method for designing a die-based vehicle controller-only semiconductor and a vehicle controller-only semiconductor manufactured by the same, and breaks the conventional semiconductor process to design and manufacture a novel conceptual vehicle controller-only semiconductor, EIP (ECU in Package), through a fusion of a new semiconductor process technique with a controller system technique, thereby obtaining an effect of capable of implementing a high performance/high quality semiconductor in micro-miniature size/ultra-light weight in a short time period.
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