Design Based Sampling and Binning for Yield Critical Defects
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United States of America Patent
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N/A
Issued Date -
N/A
app pub date -
Dec 22, 2016
filing date -
Apr 15, 2013
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Methods and systems for design based sampling and binning for yield critical defects are provided. One method includes aligning each image patch in each inspection image frame generated for a wafer by an optical subsystem of an inspection system to design information for the wafer. The method also includes deriving multiple layer design attributes at locations of defects detected in the image patches. In addition, the method includes building a decision tree with the multiple layer design attributes. The decision tree is used to separate the defects into bins with different yield impacts on a device being formed on the wafer. The method also includes binning the defects with the decision tree.
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Family
| Country | kind | publication No. | Filing Date |
|---|---|---|---|
| US | B2 | US9310320 | Apr 11, 2014 |
| TW | B | TWI604190 | Apr 15, 2014 |
| TW | B | TWI649558 | Apr 15, 2014 |
| WO | A1 | WO2014172394 | Apr 15, 2014 |
| US | B2 | US9563943 | Apr 06, 2016 |
International Classification(s)
- 2016 Application Filing Year
- G06T Class
- 11416 Applications Filed
- 7909 Patents Issued To-Date
- 69.28 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- G06T Class
- 16.26 % this patent is cited more than
- 8 Age