PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING HARDENED RELIEF PATTERN, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE

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Dec 22, 2016
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Dec 9, 2011

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Abstract

Provided is a photosensitive resin composition which comprises: (A-1) a resin containing a structure represented by general formula (1); and (B) a photo-acid generating agent. In general formula (1), X, R₁to R₇, m₁to m₄, n₁, n₂, Y and W are each as defined in the description.

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ASAHI KASEI E-MATERIALS CORPORATION	1-105 KANDA JINBOCHO CHIYODA-KU TOKYO 101-8101

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Inventor Name	Address	# of filed Patents	Total Citations
HIRATA, Tatsuya	Tokyo, JP	28	308
SASAKI, Takahiro	Tokyo, JP	257	2945
SHIBUI, Satoshi	Tokyo, JP	6	40
YAMADA, Taisuke	Tokyo, JP	7	55

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PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING HARDENED RELIEF PATTERN, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

15388540

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15388540

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