Ejector using swirl flow
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Feb 26, 2019
Grant Date -
Apr 13, 2017
app pub date -
Mar 24, 2016
filing date -
Oct 12, 2015
priority date (Note) -
In Force
status (Latency Note)
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Importance

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Abstract
An ejector for a vapor compression system using a swirl flow includes an ejector body comprising a main inlet into which a main flow in high pressure flows, a nozzle section in fluid communication with the main inlet, a mixing portion in fluid communication with the nozzle section, a diffuser in fluid communication with the mixing portion, and a discharge portion in fluid communication with the diffuser. A suction pipe is inserted in a center of the ejector body and includes a through-hole into which a suction flow in low pressure flows and a leading end portion of an outer surface of the pipe forms a plurality of inclined passages with the nozzle section of the ejector body. These passages allow the main flow to be moved to the mixing portion so as to form a swirl flow between the main flow and suction flow when mixed in the ejector.
First Claim
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Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
SAMSUNG ELECTRONICS CO LTD | SUWON-SI |
International Classification(s)

- 2016 Application Filing Year
- F25B Class
- 1355 Applications Filed
- 932 Patents Issued To-Date
- 68.79 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Cheong, Young-min | Seoul, KR | 34 | 101 |
# of filed Patents : 34 Total Citations : 101 |
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Patent Citation Ranking
- 0 Citation Count
- F25B Class
- 0 % this patent is cited more than
- 6 Age
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7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Aug 26, 2026 |
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