2-DIMENSIONAL THERMAL CONDUCTIVE MATERIALS AND THEIR USE

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United States of America Patent

APP PUB NO 20170101571A1
SERIAL NO

15285967

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Abstract

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The development and manufacture of thermal interface materials including, among other forms, greases, pastes, gels, adhesives, pads, sheets, solders and phase change materials, with good through-plane thermal conductivity for thermal interface applications. The good through-plane thermal conductivity is achieved, through the formation of a conductive network by the use of thermal conductive material-coated fillers, combinations of thermal conductive material-coated fillers and uncoated fillers.

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Patent Owner(s)

Patent OwnerAddress
NANOXPLORE INC4500 THIMENS BOULEVARD MONTREAL H4R 2P2

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukushima, Hiroyuki JP, JP 75 806
Ritch, Thomas East Lansing, US 2 1
Russell, Jessica Webberville, US 4 15
Wang, Liya Ann Arbor, US 23 654

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