METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
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United States of America Patent
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Issued Date -
Apr 6, 2017
app pub date -
May 19, 2016
filing date -
Oct 5, 2015
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Abstract
A method of fabricating a semiconductor package is disclosed. The method includes forming a plurality of semiconductor chips and a mold layer covering the semiconductor chips on a substrate, forming outer terminals on a bottom surface of the substrate, coating a water-soluble material on the bottom surface of the substrate and the outer terminals to form a coating layer, cutting the substrate and the mold layer to separate the semiconductor chips from each other, and forming a shielding layer on the cutted mold layer.
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