RESIN COMPOSITION AND MOLDED ARTICLE

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United States of America Patent

SERIAL NO

15380103

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Abstract

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A resin composition contains: 60 to 95% by mass of polyphenylene ether (A); 35 to 0% by mass of styrene-based resin (B); and 15 to 5% by mass of elastomer component (C). The component (C) is present as dispersion particles in the resin composition. The dispersion particles have a number average particle size of 0.04 to 0.25 μm.

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Patent Owner(s)

Patent OwnerAddress
ASAHI KASEI KABUSHIKI KAISHA1-1-2 YURAKUCHO CHIYODA-KU TOKYO 100-0006

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
YAMAGUCHI, Toru Tokyo, JP 110 928

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges459898782674101 - 1011 - 2021 - 3031 - 4041 - 5061 - 70050100150200250300350400450500550600650700750800850900950

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