DOUBLE-SIDED HEAT EXCHANGER FOR FLUID-COOLED ELECTRONICS WITH A FLAT COPLANAR SERIES-WISE COOLANT FLOW PATH
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Mar 30, 2017
app pub date -
Aug 4, 2016
filing date -
Sep 30, 2015
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A fluid-cooled electronics assembly for high-power electronics includes an arrangement of electronic components that defines an upper-side of the arrangement and a lower-side of the arrangement opposite the upper-side. An upper-chamber is thermally coupled to the upper-side, and a lower-chamber thermally coupled to the lower-side. The upper-chamber and the lower-chamber are further configured to direct flowing-coolant series-wise from the lower-chamber into the upper-chamber. The upper-chamber and the lower-chamber are further configured to cooperatively define a manifold-connection operable to couple the assembly to a manifold-outlet and a manifold-inlet of a coolant-manifold. The assembly also includes a fitting configured to define an inlet-port of the assembly that directs the flowing-coolant from the manifold-outlet to the lower-inlet, and an outlet-port that directs the flowing-coolant from the upper-outlet to the manifold-inlet. The inlet-port and the outlet-port are characterized as adjacent and side-by-side ports that are segregated from each other by a wall-section.
First Claim
Other Claims data not available
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
- 2 Citation Count
- H01L Class
- 18.50 % this patent is cited more than
- 8 Age