LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE AND LIGHT-EMITTING PACKAGE USING THE SAME, FABRICATING METHOD OF THE LIGHT-EMITTING ELEMENT MOUNTING SUBSTRATE AND FABRICATING METHOD OF LIGHT-EMITTING DEVICE USING THE SAME
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United States of America Patent
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Issued Date -
Mar 30, 2017
app pub date -
Sep 23, 2016
filing date -
Sep 24, 2015
priority date (Note) -
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Abstract
There is provided a light-emitting element mounting substrate which includes: an insulative base plate including a first surface and a second surface opposed to each other; a first conductive pad formed on the first surface of the insulative base plate; a second conductive pad formed on the first surface of the insulative base plate, and being separated from the first conductive pad; a first through hole and a second through hole penetrating through the insulative base plate and being separated from each other; a first through conduit filling the first through hole and being adjoined with the first conductive pad; and a second through conduit filling the second through hole and being adjoined with the second conductive pad, wherein, with reference to the first surface of the insulative base plate, a sum of an area of the first through conduit and an area of the second through conduit is between 20% and 80% of an area of the first surface of the insulative base plate.
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