Temperature Compensation of Fabricated Semiconductors

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United States of America Patent

SERIAL NO

14865526

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Abstract

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Semiconductor devices and methods are described wherein temperature dependence of leakage current in at least one pathway of a device is compensated by a resistor in the device. Control of temperature dependent leakage current is particularly useful for silicon nitride devices and for circuits such as cascode circuits. A semiconductor leakage current that increases with temperature may be compensated by a fabricated resistor such as a boron doped polysilicon resistor that is electrically connected to compensate the leakage current in the pathway.

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Patent Owner(s)

Patent OwnerAddress
SANKEN ELECTRIC CO LTD3-6-3 KITANO NIIZA-SHI SAITAMA-KEN 352-8666

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aoki, Hironori Asaka-shi, JP 45 592
KANEKO, Shuichi Yoshikawa-shi, JP 45 119

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