PACKAGE TOPSIDE BALL GRID ARRAY FOR ULTRA LOW Z-HEIGHT
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Sep 24, 2015
filing date -
Sep 24, 2015
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Embodiments of the present disclosure describe integrated circuit (IC) package assemblies having top-side connection pads, computing devices incorporating the IC package assemblies, methods for formation of the IC package assemblies, and associated configurations. An IC package assembly may include a substrate having a first side and a second side opposite the first side, an IC die coupled with the first side of the substrate, a plurality of connection pads coupled with the first side of the substrate, and a plurality of interconnect structures coupled with the plurality of connection pads. Other embodiments may be described and/or claimed.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully