HIGH TEMPERATURE MOLDABLE PRESSURE SENSITIVE ADHESIVE SYSTEM
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United States of America Patent
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Issued Date -
Mar 30, 2017
app pub date -
Sep 29, 2016
filing date -
Sep 29, 2015
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Abstract
The teachings herein include an article having an acoustic absorption material: a pressure sensitive adhesive material attached to the acoustic absorption material: and a release liner located on an opposing side of the pressure sensitive adhesive material The article is adapted to be molded into a desired shape. The molded article may then be adhered to a desired substrate upon removal of the release liner. The teachings herein also contemplate methods of forming the article and installing the article.
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