PREPREG, PRINTED CIRCUIT BOARD INCLUDING PREPREG, AND METHOD OF FABRICATING THE SAME
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United States of America Patent
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app pub date -
Apr 14, 2016
filing date -
Sep 18, 2015
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Abandoned
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Abstract
A prepreg, a printed circuit board and a method of manufacturing the same are provided. A prepreg includes a core layer including nanofibers having a thickness in a range of 10 to 100 nm, a first insulating layer on a first surface of the core layer, and a second insulating layer on a second surface of the core layer.
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