PRINTED CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Mar 23, 2017
app pub date -
Oct 9, 2015
filing date -
Sep 17, 2015
priority date (Note) -
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Abstract
A printed circuit board includes a high-density distribution area, a line sparse distribution area, a solder mask layer, and a signal layer. A first signal line is laid on the signal layer. The first signal line crosses the high-density distribution area and the line sparse distribution area. The first signal line is narrower in the high-density distribution area than in the line sparse distribution area. A first dielectric constant of the solder mask layer in the high-density distribution area is greater than a second dielectric constant of the solder mask layer in the sparse distribution area.
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