CAMERA MODULE AND METHOD FOR MANUFACTURING THE CAMERA MODULE
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United States of America Patent
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Issued Date -
Mar 23, 2017
app pub date -
Nov 11, 2015
filing date -
Sep 18, 2015
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A camera module includes a circuit board, a lens socket, a lens assembly and an image-sensing chip. The circuit board defines a nonopaque area. The lens socket is mounted on a top surface of the circuit board and covers the nonopaque area. The lens assembly is assembled in the lens socket. The lens assembly includes at least one imaging lens which makes an optical axis formed by the lens assembly penetrate through the nonopaque area. The image-sensing chip is fastened to a bottom surface of the circuit board and is electrically connected with the circuit board. The image-sensing chip is located at the optical axis. The method for manufacturing the camera module is described hereinafter. Prepare a circuit board. Prepare an image-sensing chip. Prepare a lens socket and a lens assembly.
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