Integration of an auxiliary device with a clamping device in a transient voltage suppressor
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Dec 26, 2017
Issued Date -
N/A
app pub date -
Nov 30, 2016
filing date -
Jan 31, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
Monolithic integration of low-capacitance p-n junctions and low-resistance p-n junctions (when conducting in reverse bias) is provided. Three epitaxial layers are used. The low-capacitance junctions are formed by the top two epitaxial layers. The low-resistance p-n junction is formed in the top epitaxial layer, and two buried structures at interfaces between the three epitaxial layers are used to provide a high doping region that extends from the low-resistance p-n junction to the substrate, thereby providing low resistance to current flow. The epitaxial layers are lightly doped as required by the low-capacitance junction design, so the buried structures are needed for the low-resistance p-n junction. The high doping region is formed by diffusion of dopants from the substrate and from the buried structures during thermal processing.
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
BOURNS INC | RIVERSIDE CA |
International Classification(s)

- 2016 Application Filing Year
- H01L Class
- 27971 Applications Filed
- 23507 Patents Issued To-Date
- 84.05 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Morrish, Andrew J | Saratoga, US | 39 | 269 |
# of filed Patents : 39 Total Citations : 269 | |||
Wei, Tao | Los Gatos, US | 110 | 574 |
# of filed Patents : 110 Total Citations : 574 |
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- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 8 Age
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