SURFACE-MOUNT ELECTRONIC COMPONENT
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United States of America Patent
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app pub date -
Dec 2, 2016
filing date -
Aug 31, 2015
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Abstract
A surface-mount chip is formed by a silicon substrate having a front surface and a side. The chip includes a metallization intended to be soldered to an external device. The metallization has a first portion covering at least a portion of the front surface of the substrate and a second portion covering at least a portion of the side of the substrate. A porous silicon region is included in the substrate to separating the second portion of the metallization from the rest of the substrate.
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