Methods to Reduce Case Height for Capacitors

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United States of America Patent

SERIAL NO

15263812

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for forming a high aspect ratio sintered powder anode with low warpage, an anode made thereby and a cathode comprising the anode are provided. The method comprises placing a multiplicity of anode precursors on a forming substrate in a common plane wherein no more than 10% of the anode precursors are out of the common plane. A second substrate is then placed over the forming substrate with the anode precursors between the forming substrate and the second substrate thereby forming a sandwiched assembly. The sandwiched assembly is heated to a sintering temperature of the anode precursors thereby forming the sintered powder anodes. The and sintered powder anodes are removed from between the forming substrate and the second substrate.

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Patent Owner(s)

Patent OwnerAddress
KEMET ELECTRONICS CORPORATIONONE EAST BROWARD BLVD 5TH FLOOR FORT LAUDERDALE FL 33301

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fife, James Allen Mound House, US 9 147
Lessner, Philip M Simpsonville, US 73 863
Moore, Keith Lee Simpsonville, US 7 21
Ning, Liancai Suzhou Jiangsu, CN 7 43
Stolarski, Chris Simpsonville, US 22 135

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