HEAT DISSIPATION DEVICE MANUFACTURING METHOD
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United States of America Patent
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Mar 23, 2017
app pub date -
Sep 17, 2015
filing date -
Sep 17, 2015
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Abstract
A method is disclosed for manufacturing a heat dissipation device including a substrate and at least one heat pipe, which is pressed to tightly fit in a receiving groove defined by the substrate to make two opposite lateral sides of the heat pipe tightly respectively in contact with two opposite inner sides of the receiving groove to tightly connect the substrate to the heat pipe to solve the problem existing in the conventional heat dissipation device of a poor levelness of the receiving groove on a top and a bottom side of the substrate due to secondary processing, so as to have reduced manufacturing costs and provide uniform temperature effect.
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