Housing of Electronic Apparatus and Method for Manufacturing the Same
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United States of America Patent
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Issued Date -
Mar 16, 2017
app pub date -
Dec 21, 2015
filing date -
Sep 10, 2015
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Abstract
A method for manufacturing a housing of an electronic apparatus includes forming a planar portion of the housing as a carbon fiber plate from carbon fiber material via a hot pressing process; during the hot pressing process, attaching a thermosensitive adhesive film onto a male mould surface of the carbon fiber plate corresponding to a junction between a fastening portion of the housing and the planar portion; forming the fastening portion of the housing from thermosetting resin via embedded injection molding process; and during the embedded injection molding process, curing the thermosensitive adhesive film onto the surface of the carbon fiber plate by curing the thermosetting resin so as to join the fastening portion and the planar portion of the housing together. A housing of the electronic apparatus made by the manufacturing method is also described.
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