Soldering Device Minimizing Voids When Soldering Printed Circuit Boards

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United States of America Patent

SERIAL NO

15341487

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A soldering device for soldering a printed circuit board includes at least one heating appliance melting solder situated between electrical or electronic components being soldered onto a printed circuit board and the printed circuit board. At least one actuator mechanically oscillates the printed circuit board at a variable frequency of oscillation in a direction of a plane defioned by the printed circuit board. A second lateral edge of the printed circuit board, the second lateral edge being opposite to the first lateral edge of the printed circuit board, rests against iand supported by a fixed stop.

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Patent Owner(s)

Patent OwnerAddress
ERSA GMBHLEONHARD-KARL-STRASSE 24 WERTHEIM 97877

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  • 2016 Application Filing Year
  • B23K Class
  • 2440 Applications Filed
  • 1724 Patents Issued To-Date
  • 70.66 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Rawinski, Viktoria Marktheidenfeld, DE 3 0

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges37181569129411101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6071 - 8081 - 90050100150200250300350400450500550600650700750800850900

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