ELECTRONIC EQUIPMENT HOUSINGS WITH INTEGRATED ELECTRONIC CARD GUIDES, ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDING, AND THERMAL COOLING
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United States of America Patent
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Issued Date -
Mar 9, 2017
app pub date -
Sep 8, 2015
filing date -
Sep 8, 2015
priority date (Note) -
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Abstract
An electronic equipment housing structural panel includes an integrated electronic card guide formed in the structural panel. The panel may also include and an integrated ElectroMagnetic Interference (EMI) shielding and thermal cooling structure formed in the structural panel. The EMI shielding and thermal cooling structure is in the form of apertures in one embodiment, and the apertures provide for convective heat transfer from the panel to air flowing through the apertures. In an electronic equipment housing, a pair of such panels are parallel to each other but spaced apart from each other with their card guides facing each other. An electronic card may then be installed in the card guides. In an embodiment, a structural panel is produced by forming the integrated electronic card guide, and the integrated EMI shielding and thermal cooling structure if provided, in a blank of material.
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