LIGHT-EMITTING DIODE PACKAGE
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United States of America Patent
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Issued Date -
Mar 9, 2017
app pub date -
Aug 3, 2016
filing date -
Sep 7, 2015
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Abstract
A light-emitting diode package is provided. The light-emitting diode package includes a lead-frame, a reflective cup and a die. The lead-frame is made of a silver-free material. The reflective cup has the cavity. The die is disposed on the lead-frame in a face-down orientation, and is further electrically connected to the lead-frame and located within the cavity.
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