TRANSFERRING MEMBER AND PRESSURE APPLYING UNIT

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United States of America Patent

SERIAL NO

15122926

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Abstract

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Provided is transferring members having a plate-like shape used in baking a metal particle paste of an assembled body formed by arranging an electronic part on a substrate with the metal particle paste interposed therebetween by applying pressure to the assembled body and by heating the assembled body, the transferring members being configured to sandwich the assembled body in baking the metal particle paste, wherein the transferring members are made of a material having thermal conductivity which falls within a range of from 1 to 200 W/(m k) and Vickers hardness which falls within a range of from 180 to 2300 kgf/mm2.

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Patent Owner(s)

Patent OwnerAddress
SHINDENGEN ELECTRIC MANUFACTURING CO LTD2-1 OHTEMACHI 2-CHOME CHIYODA-KU TOKYO 100-0004

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MATSUBAYASHI, Ryo Saitama, JP 8 28

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