MULTIPLE CHAMBER CHEMICAL VAPOR DEPOSITION SYSTEM
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United States of America Patent
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Mar 9, 2017
app pub date -
Aug 24, 2016
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Sep 3, 2015
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Abstract
A chemical vapor deposition system is disclosed herein. The chemical vapor deposition system has a plurality of reaction chambers to operate independently in the growth of epitaxial layers on wafers within each of the reaction chambers for the purpose of reducing processing time while maintaining the quality necessary for the fabrication of high-performance semiconductor devices.
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