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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
OERLIKON METCO AG WOHLEN	5610 WOHLEN

International Classification(s)

• B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....

• 2015 Application Filing Year
• B23K Class
• 2354 Applications Filed
• 1765 Patents Issued To-Date
• 74.98 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
GISLER, Andreas	Riet bei Neftenbach, CH	30	105
# of filed Patents : 30 Total Citations : 105
LEUPPI, Tobias	Dottikon, CH	2	2
# of filed Patents : 2 Total Citations : 2
PETERS, Thomas	Lenzburg, CH	14	98
# of filed Patents : 14 Total Citations : 98

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Patent Citation Ranking

• 0 Citation Count
• B23K Class

• 0 % this patent is cited more than
• 8 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Sep 9, 2028

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2017/0157,717

SOLDER FLUX

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Abstract

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There is provided the use of at least one ionic liquid as a soldering/brazing flux. There is also provided a method of soldering a metal comprising applying a solder/braze comprising a flux to a surface of the metal and heating said metal to a desired soldering/brazing temperature, wherein the soldering/brazing flux comprises one or more ionic liquids.

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Description

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Claims

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