Radio frequency micro-electromechanical systems having inverted microstrip transmission lines and method of making the same
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United States of America Patent
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Apr 24, 2018
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app pub date -
Aug 28, 2015
filing date -
Aug 28, 2015
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Abstract
A radio frequency (RF) microelectromechanical system (MEMS) package includes a first mounting substrate, a signal line formed on a top surface of the first mounting substrate, the signal line comprising a MEMS device selectively electrically coupling a first portion of the signal line to a second portion of the signal line, and a ground assembly coupled to the first mounting substrate. The ground assembly includes a second mounting substrate, a ground plane formed on a bottom surface of the second mounting substrate, and at least one electrical interconnect extending through a thickness of the second mounting substrate to contact the ground plane, wherein the ground plane is spaced apart from the signal line.
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