METHOD FOR MANUFACTURING COIL LOADING BOARD

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United States of America Patent

APP PUB NO 20170062125A1
SERIAL NO

14881279

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Abstract

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A method for manufacturing a coil loading board includes following steps: providing a first plate configured single-side adhesive and double-side adhesive on both sides thereof; defining a first slot, a first through hole, a first connection hole and a groove through both sides of the first plate; providing a second plate configured double-die adhesive on a side thereof; forming a second slot, a second through hole and a second connection hole through both sides of the second plate; fixing the first plate and the second plate together; removing the single-side adhesive of the first plate.

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Patent Owner(s)

Patent OwnerAddress
FOXCONN TECHNOLOGY CO LTD3-2 CHUNG SHAN ROAD TU-CHENG TAIPEI HSIEN

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  • 2015 Application Filing Year
  • H01F Class
  • 2018 Applications Filed
  • 1634 Patents Issued To-Date
  • 80.98 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20152016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LEE, Chia-Chin New Taipei, TW 4 3

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1564422693101 - 1011 - 2021 - 3031 - 4071 - 800255075100125150175200225250275300325350375400425450475

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