METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20170062100A1
SERIAL NO

14833191

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Calculated Rating
US Family Size
Non-US Coverage

Abstract

See full text

In a method for manufacturing a multilayer substrate, first, a via hole is formed in a first insulating layer and a second insulating layer and filled with conductive paste. Subsequently, the first insulating layer and the second insulating layer are stacked on each other. Next, the conductive paste is cured to form a via conductor while the first insulating layer and the second insulating layer are integrated through thermal pressing. Then, a penetrating hole that penetrates the via conductor in the laminating direction is formed.

First Claim

See full text

Other Claims data not available

Family

PCTEP
+
−
  • No Family data available.

Patent Owner(s)

Patent OwnerAddress
MURATA MANUFACTURING CO LTDJAPAN

International Classification(s)

loading....
  • 2015 Application Filing Year
  • H01B Class
  • 1402 Applications Filed
  • 1066 Patents Issued To-Date
  • 76.04 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201520162017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
YOSUI, Kuniaki Nagaokakyo-shi, JP 182 1422

Cited Art Landscape

Load Citation

Patent Citation Ranking

  • 2 Citation Count
  • H01B Class
  • 27.71 % this patent is cited more than
  • 8 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges161371299621201 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 700255075100125150175200225250275300325350375400

Forward Cite Landscape

Load Citation