MULTI-LAYER FORMS AND METHODS OF MANUFACTURING THE SAME

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United States of America Patent

SERIAL NO

15333165

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Multi-layer forms and methods of producing the same are disclosed. An example apparatus includes means for moving a first substrate in a direction; means for applying adhesive to a first portion of a first side of the first substrate; means for mating a second substrate with the first portion; means for applying adhesive to a third portion of a second side of the first substrate; means for folding the first substrate about a first fold line to couple the third portion to a fourth portion of the second side; means for applying adhesive to a first sub-portion of a second portion of the first side; and means for folding the first substrate and the second substrate about a second fold line to couple a face of the first sub-portion and a face of a second sub-portion of the second portion and to position the first substrate between the second substrate.

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Patent Owner(s)

Patent OwnerAddress
R R DONNELLEY & SONS COMPANY750 WARRENVILLE ROAD LISLE ILLINOIS 60532

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Baeten, Lynn Green Bay, US 2 5
Johnson, Joshua Green Bay, US 32 138
Pulley, Kevin De Pere, US 2 5
Wood, Eric M Schaumburg, US 3 9

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