RESIN MOLDING METHOD AND RESIN MOLDING DIE SET
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United States of America Patent
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Issued Date -
Feb 23, 2017
app pub date -
Feb 27, 2015
filing date -
Mar 17, 2014
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Abstract
A technology capable of improving the production yield of molded articles. A film is supplied to a die surface of a resin molding die set. Next, the film is adhered to the die surface and caused to be in a state of being separated from the die surface at a corner section of a cavity recess. Next, a die set is closed to clamp the film. Next, a resin filling the interior of the cavity recess is thermoset, on the film provided therebetween, while adhering the film to the corner section.
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