Method and device for trenchless pipe laying
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United States of America Patent
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-
Oct 15, 2019
Grant Date -
Feb 16, 2017
app pub date -
Dec 18, 2014
filing date -
Dec 23, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
Methods and devices for a boring and laying device for the trenchless laying of a pipeline, including a boring head, wherein the boring head includes a connection for a pilot bore linkage, wherein a pilot bore is produced from a starting point to a destination point along a predetermined boring line, a pump for suctioning and conveying away the drillings, a conveying portion behind the boring head in which at least one suction element for receiving and conveying away drillings, and a connecting portion including a connection for the pipeline. The pilot borehole is expanded, and simultaneously the pipeline is laid by pulling the pilot bore linkage out of the borehole on one side and/or by pushing the pipeline into the borehole, wherein drillings are hydraulically received behind the boring head of the boring and laying device and conveyed away out of the borehole with a pump.
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