SECURITY DEVICE COMPONENTS AND METHODS OF MANUFACTURE THEREOF
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Feb 16, 2017
app pub date -
Apr 23, 2015
filing date -
Apr 30, 2014
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A method of manufacturing a security device component includes: providing a photosensitive film including a diazonium compound which decomposes upon exposure to radiation of a predetermined wavelength; providing a dye coupler film comprising one or more dye coupler compositions; exposing elements of the photosensitive film to radiation of the predetermined wavelength in accordance with a predetermined pattern; and contacting at least part of the exposed photosensitive film against at least part of the dye coupler film so as to effect at least partial transfer of the one or more dye coupler compositions to the exposed photosensitive film, whereupon unexposed elements of the photosensitive film exhibit one or more colours such that the photosensitive film exhibits a reproduction of the predetermined pattern.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully