LEAD-FREE CUNI2SI SLIDING BEARING MATERIAL WITH THE ADDITION OF A METAL HAVING A CHIP-BREAKING EFFECT
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United States of America Patent
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Feb 9, 2017
app pub date -
Apr 16, 2015
filing date -
Apr 16, 2014
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Abstract
The invention relates to a sliding bearing material with a matrix material which consists of 0.5-5 wt. % nickel, 0.25-2.5 wt. % silicon, <0.1 wt. % lead, impurities that result from the metallurgical smelting process, and the rest being copper, with optionally at least one hard material and optionally at least one solid lubricant, and which has at least one tellurium additive. The invention also relates to a sliding bearing composite material which has a carrier layer, a bearing metal layer and a sliding layer applied to said bearing metal layer, the bearing metal layer consisting of such a sliding bearing material, as well as to a sliding element or sliding bearing that consists of such a sliding bearing composite material.
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