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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
THIELE KAOLIN COMPANY	P O BOX 1056 SANDERSVILLE GA 31082

International Classification(s)

• C09C:TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBRO....

• 2016 Application Filing Year
• C09C Class
• 246 Applications Filed
• 180 Patents Issued To-Date
• 73.18 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Li, Yaping	Evans, US	15	51
# of filed Patents : 15 Total Citations : 51
Zhang, Zhenzhong	Sandersville, US	58	35
# of filed Patents : 58 Total Citations : 35

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• 0 Citation Count
• C09C Class

• 0 % this patent is cited more than
• 5 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Apr 27, 2028
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Apr 27, 2032

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
October 27, 2020	US,10815380,B2   US10815380B2	GRANTED PATENT AS SECOND PUBLICATION
February 09, 2017	US,20170037250,A1   US20170037250A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent Application No: 2019/0208,854

HELMET WITH INTEGRATED SENSORS

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Abstract

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A ballistic helmet system having an integrated circuit layer electrically coupled to one or more powered devices, where the ballistic helmet is configured to operate and control the powered devices. The ballistic helmet system comprises a base layer configured to retain the circuit layer. The circuit layer comprises one or more circuit substrates, which may be formed of a flexible material capable of withstanding elevated temperatures that may result from the bonding and curing process of the helmet components.

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Description

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Claims

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