Stress relief MEMS structure and package
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United States of America Patent
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Dec 26, 2017
Issued Date -
N/A
app pub date -
Oct 19, 2016
filing date -
Feb 6, 2015
priority date (Note) -
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Abstract
Stress relief structures and methods that can be applied to MEMS sensors requiring a hermetic seal and that can be simply manufactured are disclosed. The system includes a sensor having a first surface and a second surface, the second surface being disposed away from the first surface, the second surface also being disposed away from a package surface and located between the first surface and the package surface, a number of support members, each support member extending from the second surface to the package surface, the support members being disposed on and operatively connected to only a portion of the second surface. The support member are configured to reduce stress produced by package-sensor interaction.
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