STACK PACKAGE AND METHOD FOR MANUFACTURING THE STACK PACKAGE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Feb 2, 2017
app pub date -
Oct 28, 2015
filing date -
Jul 31, 2015
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A stack package may include a substrate, and a first semiconductor chip mounted over the substrate. The stack package may include a support member disposed over the substrate and the first semiconductor chip, and spaced apart from the substrate and the first semiconductor chip. The stack package may include a plurality of second semiconductor chips stacked over the support member.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully