STRUCTURES AND METHODS FOR SEMICONDUCTOR PACKAGING
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United States of America Patent
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app pub date -
Jul 28, 2016
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Jul 31, 2015
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Abstract
A semiconductor package including a lead frame having a die pad and a plurality of leads arranged along at least a portion of a periphery of the semiconductor package, a semiconductor die secured to the die pad, wherein at least a portion of the semiconductor die extends beyond a periphery of the die pad, and a molding material encapsulating the semiconductor die and at least a portion of the die pad.
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